Semiconductor Back-End Manufacturing - Part 2
Master all process steps of the semiconductor back-end manufacturing - Part 2 - Mounting, Singulation, UV, AOI
Semiconductor Back-End Manufacturing - Part 2 free download
Master all process steps of the semiconductor back-end manufacturing - Part 2 - Mounting, Singulation, UV, AOI
Mastering Semiconductor Back-End Manufacturing: From Fundamentals to Advanced Techniques
Unlock the secrets of semiconductor back-end manufacturing with my comprehensive Udemy course! Designed for both beginners and seasoned professionals, this course dives deep into the intricate world of semiconductor fabrication, focusing on the critical back-end processes that transform silicon wafers into powerful, high-performance chips.
What You'll Learn:
Core Principles: Understand the foundational concepts of back-end semiconductor manufacturing.
Advanced Techniques: Master the latest industry techniques and best practices.
Process Integration: Gain insights into all wafer back-end manufacturing steps from taping up to the final packaging and everything in between.
Quality Control: Learn how to ensure top-tier quality and reliability in chip production.
Why enroll?
Expert Instruction: Learn from an industry expert with years of hands-on experience.
Real-World Applications: Get practical knowledge applicable to current and emerging technologies.
Interactive Content: Engage with multimedia lectures, detailed case studies, and hands-on projects.
Career Advancement: Equip yourself with skills that are in high demand across the semiconductor industry.
Whether you aim to advance your career, break into the semiconductor field, or simply broaden your technical knowledge, this course offers the tools and expertise you need to succeed. Enroll now and start your journey towards becoming a semiconductor manufacturing expert!
In part 2, you will learn about:
Mounting: The process of putting the wafer on dicing tape and frame in order to prepare it for the next process step, the singulation.
Singulation: The separation of individual chips from the processed wafer, typically using dicing saws or laser cutting, to create discrete semiconductor devices.
UV Irradiation: The exposure of the wafer or dicing tape to ultraviolet (UV) light to weaken the adhesive strength of the tape, making it easier to remove individual dies without damage.
AOI (Automated Optical Inspection): A non-contact inspection method that uses high-resolution cameras and image processing algorithms to detect defects, misalignments, or contamination in semiconductor components.
