FinFET Process Integration (Semiconductor Academy 7)

FinFET Process Integration (Semiconductor Academy 7) free download

Semiconductor Process Flow/Process Integration, FinFET (Fin Field-Effect Transistor), FEOL/MEOL/BEOL, SiGe, strained Si

• This course provides a comprehensive overview of FinFET process flow and strained Si technique. You'll learn critical process concepts and purpose of each process step, equipping you with the state-of-the-art knowledge and skills to enter the semiconductor foundries.

• What you will learn in this class ?   

  (1)  What is FinFET & Why we need FinFET?

  
  

  (2)  FinFET Process Overview

  • Front end of line (FEOL): Transistor formation

  • Middle end of line (MEOL): Contact formation

  • Back end of line (BEOL): Interconnect formation

    
    

  (3)  Front End of Line (FEOL): Transistor Formation, including the following steps,

  • Fin formation

  • STI (Shallow Trench Isolation) engineering

  • Well engineering

  • Gate engineering

  • LDD (Lightly Doped Drain)/ Spacer/ S&D Epitaxy/ Silicide/ ILD (Inter Layer Dielectric) engineering

  
  

  (4)  HKMG (High-K Metal Gate) technique

  • What is HKMG and its advantage

  • Comparison between HKMG and Poly Gate

  
  

  (5) Introduction to HCI (Hot Carrier Injection) effect

  
  

  (6) Introduction to Strained Silicon technique

  • Material Science: SiGe & SiP epitaxy

    
    

  (7) Middle End of Line (MEOL): Contact Formation, including the following steps,

  • MP/MD formation

    
    

  (8)  Back End of Line (BEOL): Interconnect Formation, including the following steps,

  • Metal layer engineering

  • IMD (Inter Metal Dielectric) / Via engineering

  • Passivation/ AP engineering

  • Dual Damascene process

    
    

  (9)  Ending & Forecast:

  • An overview from past courses to future courses